● Supports wiring design for a wide variety of electronic devices with different manufacturing environments.
Equipped with functions specialized for designing 3D laminated structures.
Achieves high efficiency in each design work from concept design to manufacturing.
● There is no limit to the layer configuration and library registration that affect the performance of the tool.
You can build your own design for next-generation electronic devices.
● In addition to manual operation using the command menu, automation using the programming function enables users to save time and improve quality.
■ Wiring design
It is equipped with functions for designing various electronic devices such as Si interposers and RDL wiring as well as rigid boards / flexible boards.
Rigid board design
Unlimited multilayer board
Flexible board design
LSI RDL wiring
Other special wiring
Next electronic devices
■ Package substrate
We support various package designs due to differences in manufacturing processes.
Chip information can be used smoothly for efficient design.
Various PKG designs
LSI internal connection
Next Generation Packaging
■ State-of-the-art module
You can build a design that fits the structure of a state-of-the-art electronic device.
The layer configuration according to manufacturing can be set freely without any restrictions.
Optical & electrical wiring
Board with built-in parts
Dielectric structure design
■ Specialized function
We support the development of new devices for the next generation and special data processing.
A new style of design is realized by customizing with a dedicated program language.
Restoration of CAD data
Coordination with wiring