Device design:CAD
● Supports wiring design for a wide variety of electronic devices with different manufacturing environments.
Equipped with functions specialized for designing 3D laminated structures.
Achieves high efficiency in each design work from concept design to manufacturing.
● There is no limit to the layer configuration and library registration that affect the performance of the tool.
You can build your own design for next-generation electronic devices.
● In addition to manual operation using the command menu, automation using the programming function enables users to save time and improve quality.
■ Wiring design
It is equipped with functions for designing various electronic devices such as Si interposers and RDL wiring as well as rigid boards / flexible boards.
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Rigid board design
Unlimited multilayer board
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Flexible board design
Unlimited nesting
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Silicon interposer
LSI RDL wiring
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Other special wiring
Next electronic devices
■ Package substrate
We support various package designs due to differences in manufacturing processes.
Chip information can be used smoothly for efficient design.
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Various PKG designs
BGA/CSP/FOWLP/POP
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Bonding wire
Lead frame
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TSV stack
LSI internal connection
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Next Generation Packaging
Minimal Fab
■ State-of-the-art module
You can build a design that fits the structure of a state-of-the-art electronic device.
The layer configuration according to manufacturing can be set freely without any restrictions.
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Panel module
FPD/LCD/PDP/EL
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Optical module
Optical & electrical wiring
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Heterogeneous Module
Chip-Package-Board
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Board with built-in parts
Dielectric structure design
■ Specialized function
We support the development of new devices for the next generation and special data processing.
A new style of design is realized by customizing with a dedicated program language.
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Restoration of CAD data
Edit attributes
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Schematic programming
Coordination with wiring
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Reverse engineering
Specialized functions
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Programming design
Original language
⇒ Question / Request for materials