Various IC packaging designs

Support for sophisticated "IC packaging design".

Implementation of wiring design for a wide variety of package structures.

◆ Correspondence example
Flip chip BGA, Wire bond BGA, Memory package (µBGA, HMC)
Chip Scale Package (CSP), Wafer Level CSP (WLCSP)
Fanout WLP (FOWLP)

Package-on-package (POP), Package-in-package (PIP)
System-in-package (SiP), System-on-chip (SOC)
Multi-chip module (MCM), Multi-chip package (MCP)
LTCC Package Interposer

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