3D connection with package object

A TSV type component stack can be used to configure stacking package connections.

For TSV parts, you can register pins on the top and bottom of the part to specify the connections inside the part.
Parts can be stacked up and down and recognize the net connection.
The connection between each device can be configured with simple parts to manage the entire system.

◆ In addition, the device can be configured in more detail by combining various 3D parts and modules.

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